Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Saved in:
Bibliographic Details
Published in:Journal of electronic materials 2012, Vol.41 (2), p.241-252
Main Authors: LIANG YIN, LUKE WENTLENT, LINLIN YANG, ARFAEI, Babak, OASAIMEH, Awni, BORGESEN, Peter
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Cross-disciplinary physics: materials science
rheology
Electronics
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials
Materials science
Metals. Metallurgy
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
Physics
Precipitation
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0361-5235
1543-186X