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Martensitic Transformation in Sn-Rich Snln Solder Joints: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

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Bibliographic Details
Published in:Journal of electronic materials 2012, Vol.41 (2), p.336-351
Main Authors: LEE, K.-O, MORRIS, J. W, HUA, Fay
Format: Article
Language:English
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Online Access:Get full text
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ISSN:0361-5235
1543-186X