Mechanical Design and Characterization for MEMS Thin-Film Packaging

• Published in: Journal of microelectromechanical systems 2012-02, Vol.21 (1), p.100-109
• Main Authors: Santagata, F., Zaal, J. J. M., Huerta, V. G., Mele, L., Creemer, J. F., Sarro, P. M.
• Format: Article
• Language: English
• Subjects: Capping; Design engineering; Encapsulation; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Materials; Mechanical instruments, equipment and techniques; Microelectromechanical systems; Micromechanical devices; Micromechanical devices and systems; Packages; Packaging; Physics; Plates (structural members); Silicon compounds; Silicon nitride; Stress; Thin films; Thin-film encapsulation; Transfer molding; wafer-level packaging
• ISSN: 1057-7157; 1941-0158
• DOI: 10.1109/JMEMS.2011.2170817

In this paper, a thin-film packaging approach is developed. It is meant to provide microelectromechanical systems (MEMS) devices with hermetic encapsulation that is sufficiently strong for transfer molding. A flat slab structure supported by columns is considered as basic geometry for the mechanical model. It takes into account both the plate deflection and the stress at the interface with the columns. To verify the model validity, thin-film packages are fabricated using silicon nitride as material for the capping layer. Both high- and low-temperature processes are used to fabricate the packages. The packages differ for the diameter of the columns (from 2 μm to 28 μm), the distances between columns (from 20 μm to 100 μm), and the capping layer thickness (from 3 μm to 7 μm). The packages are tested at different pressures up to 12.5 MPa (125 bar). Failure points agree well with the mechanical model. The largest package fabricated is a square package of 300 μm side length and with four columns (10 μm diameter) in the middle. It withstands a pressure of 10 MPa with a thin SiN capping layer with a thickness of 6 μm. Moreover, the packages are carried through grinding, dicing, and transfer molding, demonstrating that the presented thin-film encapsulation approach is robust enough for commercial first-level packaging.