Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression : Lead-free solder and packaging

Saved in:
Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2012, Vol.23 (1), p.2-7
Main Authors: CHANGDONG ZOU, YULAI GAO, BIN YANG, QIJIE ZHAI
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Cross-disciplinary physics: materials science
rheology
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Integrated circuits
Joining, thermal cutting: metallurgical aspects
Materials science
Metals. Metallurgy
Nanopowders
Nanoscale materials and structures: fabrication and characterization
Physics
Scanning probe microscopes, components and techniques
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0957-4522
1573-482X