A numerical study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling

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Bibliographic Details
Published in:Journal of mechanical science and technology 2012-04, Vol.26 (4), p.1257-1263
Main Authors: SHANGLONG XU, GUANGXIN HU, JIE QIN, YUE YANG
Format: Article
Language:English
Subjects:
Applied fluid mechanics
Applied sciences
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Fluid dynamics
Fluidics
Fundamental areas of phenomenology (including applications)
Mechanical engineering. Machine design
Physics
Precision engineering, watch making
Online Access:Get full text
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ISSN:1738-494X
1976-3824
DOI:10.1007/s12206-012-0209-x