Impact of Packaging Design on Reliability of Large Die Cu/Low- \kappa (BD) Interconnect

This paper presents the study on the effect of low-κ stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-κ chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bump shear characterization has be...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-05, Vol.2 (5), p.807-816
Main Authors: Chai, T. C., Zhang, X., Li, H. Y., Sekhar, V. N., Khan, O. K. N., Lau, J., Murthy, R., Yeow Meng Tan, Cheng, C. K., Siao Li Liew, Dongzhi Chi
Format: Article
Language:English
Subjects:
AGING MECHANISMS
Applied sciences
Arrays
Assembly
Chips (electronics)
CONNECTORS (ELECTRICAL)
Construction
Copper
Cu/low- kappa chip
Delamination
Design engineering
Design. Technologies. Operation analysis. Testing
DIES
Electronics
Exact sciences and technology
IMPACT PROPERTIES
Integrated circuits
low- kappa stack chip
package reliability
Packages
PACKAGING
pad structure
Passivation
Reliability
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Shear
shift pad design
Stress
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Summary:This paper presents the study on the effect of low-κ stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-κ chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bump shear characterization has been performed on the integrity of different stacked layer and pad structure, supported by bump shear modeling analysis. Initial reliability testing was performed on assembled package to identify the best choice of design and finally implemented on the reliability test vehicle for verification. In addition, a potential chip crack problem due to excessive warpage in FCBGA with large die assembly is examined and a simple failure criterion is proposed.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2011.2182351