Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

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Bibliographic Details
Published in:Journal of electronic materials 2013, Vol.42 (2)
Main Author: FREAR, Darrel
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Electronics
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials
Metals. Metallurgy
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0361-5235
1543-186X