Characterization and Adhesion in Cu/Ru/Si02/Si Multilayer Nano-scale Structure for Cu Metallization

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Bibliographic Details
Published in:Journal of materials engineering and performance 2013, Vol.22 (4), p.1085-1090
Main Authors: CHAWLA, N, VENKATESH, S. H, SINGH, D. R. P, ALFORD, T. L
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties
Mechanical and acoustical properties
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Online Access:Get full text
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ISSN:1059-9495
1544-1024