3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS

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Bibliographic Details
Published in:Journal of electronic materials 2014, Vol.43 (3), p.708-716
Main Authors: BELHENINI, Soufyane, TOUGUI, Abdellah, BOUCHOU, Abdelhake, MOHAN, Ranganathan, DOSSEUL, Franck
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Physics
Structure and morphology
thickness
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
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ISSN:0361-5235
1543-186X