Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS

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Bibliographic Details
Main Authors: HSU, Hsueh-Hsien, CHIU, Tz-Cheng, HUANG, Yi-Ting, WU, Albert T, CHANG, Tao-Chih, HUANG, Shin-Yi, LEE, Hsin-Yi, KU, Ching-Shun, LIN, Yang-Yi, SU, Chien-Hao, CHOU, Li-Wei, OUYANG, Yao-Tsung
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Fractures
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Physics
Thermal expansion
thermomechanical effects and density
Thermal properties of condensed matter
Thermal properties of crystalline solids
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ISSN:0361-5235
1543-186X