Residual stresses influence on the structural evolution of Cu-Mo solid solutions studies by X-ray diffraction

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Bibliographic Details
Main Authors: GOUDEAU, P, MIMAULT, J, GIRARDEAU, T, REKLAOUI, K, PROUX, O, BRANGER, V
Format: Conference Proceeding
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Online Access:Get full text
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ISSN:0040-6090
1879-2731