Application of a CFD tool for system-level thermal simulation

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1994, Vol.17 (4), p.564-572
Main Author: TOM LEE, T. Y
Format: Article
Language:English
Subjects:
Applied sciences
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Theoretical study. Circuits analysis and design
Online Access:Get full text
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ISSN:1070-9894
1558-3686