Room-temperature deposition of SiNx using ECR-PECVD for III/V semiconductor microelectronics in lift-off technique

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Bibliographic Details
Published in:Journal of non-crystalline solids 1995-07, Vol.187, p.334-339
Main Authors: WIERSCH, A, HEEDT, C, SCHNEIDERS, S, TILDERS, R, BUCHALI, F, KUEBART, W, PROST, W, TEGUDE, F. J
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0022-3093
1873-4812
DOI:10.1016/0022-3093(95)00160-3