Polymer dielectrics for multichip module packaging : Multichip module technology

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Bibliographic Details
Published in:Proceedings of the IEEE 1992, Vol.80 (12), p.1942-1954
Main Author: GARROU, P
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0018-9219