Silicon etch using vapor phase HF/H2O and O3

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1993, Vol.140 (2), p.567-570
Main Authors: WONG, M, BOWLING, R. A
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
adhesion
Physics
Solid surfaces and solid-solid interfaces
Solid-fluid interfaces
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Online Access:Get full text
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Summary:
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2221090