On-chip wiring design challenges for Gigahertz operation: Interconnections-Addressing the Next Challenge of IC Technology. Part I: Integration and Packaging Trends

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Bibliographic Details
Published in:Proceedings of the IEEE 2001, Vol.89 (4), p.529-555
Main Authors: DEUTSCH, Alina, COTEUS, Paul W, KOPCSAY, Gerard V, SMITH, Howard H, SUROVIC, Christopher W, KRAUTER, Byron L, EDELSTEIN, Daniel C, RESTLE, Phillip J
Format: Article
Language:English
Subjects:
Applied sciences
Computer-aided design of microcircuits
layout and modeling
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Metallization, contacts, interconnects
device isolation
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0018-9219
1558-2256