Impact of Packaging Design on Reliability of Large Die Cu/Low-[Formula Omitted] (BD) Interconnect

This paper presents the study on the effect of low-[Formula Omitted] stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-[Formula Omitted] chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bu...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-05, Vol.2 (5), p.807
Main Authors: Chai, Tai Chong, Zhang, Xiaowu, Li, Hong Yu, Sekhar, Vasarla Nagendra, Khan, Oratti Kalandar Navas, Lau, John, Murthy, Ramana, Tan, Yeow Meng, Cheng, Chek Kweng, Liew, Siao Li, Chi, Dongzhi
Format: Article
Language:English
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Summary:This paper presents the study on the effect of low-[Formula Omitted] stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-[Formula Omitted] chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bump shear characterization has been performed on the integrity of different stacked layer and pad structure, supported by bump shear modeling analysis. Initial reliability testing was performed on assembled package to identify the best choice of design and finally implemented on the reliability test vehicle for verification. In addition, a potential chip crack problem due to excessive warpage in FCBGA with large die assembly is examined and a simple failure criterion is proposed.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2011.2182351