Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

A comprehensive electro-thermo-mechanical transient investigation is carried out to characterize time-dependent thermal and mechanical responses of metal wire bonding interconnects, as they suffer from the impact of an electromagnetic pulse (EMP) with different current or voltage waveforms. In our m...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2010-08, Vol.33 (3), p.729-737
Main Authors: Kong, Fan-Zhi, Yin, Wen-Yan, Mao, Jun-Fa, Liu, Qing Huo
Format: Article
Language:English
Subjects:
Algorithms
Applied sciences
Bonding
Computer simulation
Design. Technologies. Operation analysis. Testing
Electric wire
Electromagnetic pulse (EMP)
Electromagnetic pulses
Electromagnetic transients
Electronics
EMP radiation effects
Exact sciences and technology
Finite element methods
Integrated circuits
Mathematical analysis
Mathematical models
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
temperature-dependent material parameters
Thermal conductivity
Thermal expansion
Thermal stresses
Time domain analysis
time-domain electro-thermo-mechanical finite element method
transient responses
Voltage
Waveforms
Wire
wire bonding interconnects
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Summary:A comprehensive electro-thermo-mechanical transient investigation is carried out to characterize time-dependent thermal and mechanical responses of metal wire bonding interconnects, as they suffer from the impact of an electromagnetic pulse (EMP) with different current or voltage waveforms. In our mathematical implementation, a hybrid time-domain finite element method is applied to simulate mutual interactions among electrical, thermal, and mechanical fields, with all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of materials being treated appropriately. The developed algorithm is partially validated by computing transient temperature and thermal stress of other interconnects with good agreement with reference results. Parametric studies are performed to show the effects of EMP waveform parameters, geometrical and physical parameters of various wire bonding interconnects on their transient thermal and mechanical responses, thus providing basic information for their electromagnetic protection so as to suppress the impact of an intentional EMP.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2010.2048902