Bonding of soda-lime glass microchips at low temperature

A simple, low-temperature bonding process is described for the fabrication of soda-lime glass microfluidic chips. Due to its chemical inertness and temperature stability, glass remains a popular material for microfluidic chips despite the advances that have been made with polymer materials. Conventi...

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Bibliographic Details
Published in:Microfluidics and nanofluidics 2007-02, Vol.3 (1), p.119-122
Main Authors: Iles, Alexander, Oki, Akio, Pamme, Nicole
Format: Article
Language:English
Subjects:
Fabrication
Low temperature
Polymers
Semiconductors
Temperature
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Summary:A simple, low-temperature bonding process is described for the fabrication of soda-lime glass microfluidic chips. Due to its chemical inertness and temperature stability, glass remains a popular material for microfluidic chips despite the advances that have been made with polymer materials. Conventional thermal bonding is performed over the course of 24 h at 600°C and requires a precise temperature-controlled furnace. Here we introduce a simple low-temperature alternative for the high-strength bonding of soda-lime glass wafers based on the use of diluted HF solution in combination with pressure at a temperature of 65°C.[PUBLICATION ABSTRACT]
ISSN:1613-4982
1613-4990
DOI:10.1007/s10404-006-0101-z