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Calculation of the temperature field of a printed-circuit board with account for convective and radiative heat exchange on the board surface
The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally....
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Published in: | Journal of engineering physics and thermophysics 2002-09, Vol.75 (5), p.1223-1226 |
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Main Authors: | , , |
Format: | Article |
Language: | eng ; rus |
Subjects: | |
Online Access: | Get full text |
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Summary: | The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ±4°C.[PUBLICATION ABSTRACT] |
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ISSN: | 1062-0125 1573-871X |
DOI: | 10.1023/A:1021196431370 |