Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects

Most electronic systems are rigid and inflexible. Many applications, however, require or benefit from conformable designs. To create efficient conformable systems, multilayer stretchable interconnects are necessary. A novel strain relief structure for multilayer stretchable interconnects is proposed...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2013-07, Vol.60 (7), p.2338-2345
Main Authors: Yung-Yu Hsu, Lucas, K., Davis, D., Elolampi, B., Ghaffari, R., Rafferty, C., Dowling, K.
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Failure analysis
finite element methods
flexible electronics
Gold
Integrated circuit interconnections
integrated circuit packaging
Integrated circuits
materials reliability
Plastics
Resistance
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Strain
stress
Substrates
Testing, measurement, noise and reliability
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Summary:Most electronic systems are rigid and inflexible. Many applications, however, require or benefit from conformable designs. To create efficient conformable systems, multilayer stretchable interconnects are necessary. A novel strain relief structure for multilayer stretchable interconnects is proposed. The numerical analysis shows that the proposed structure will function indefinitely when stretched as much as 20% of its initial length. Electromechanical measurements demonstrate that the onset of microcrack formation in the interconnects occurs, on average, after 89% elongation. These measurements also show that the structures are able to withstand elongations of up to 285%. Additionally, precise failure mechanisms, including interconnect straightening and microcrack formation are documented.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2013.2264217