Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

• Published in: Journal of electronic materials 2013-08, Vol.42 (8), p.2667-2676
• Main Authors: Sharif, Ahmed, Lim, Jun zhang, Made, Riko I, Lau, Fu Long, Phua, Eric Jian Rong, Lim, Ju Dy, Wong, Chee Cheong, Gan, Chee Lip, Chen, Zhong
• Format: Article
• Language: English
• Subjects: Applied sciences; Ceramics; Characterization and Evaluation of Materials; Chemistry and Materials Science; Condensed matter: structure, mechanical and thermal properties; Electronics; Electronics and Microelectronics; Exact sciences and technology; Glass; High temperature; Instrumentation; Materials Science; Mechanical and acoustical properties; Metals; Microelectronic fabrication (materials and surfaces technology); Optical and Electronic Materials; Physical properties of thin films, nonelectronic; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solid State Physics; Structure and morphology; thickness; Substrates; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-013-2613-0

A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10 min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500 h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging.