Copper Wire Bonding Concerns and Best Practices

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the...

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Bibliographic Details
Published in:Journal of electronic materials 2013-08, Vol.42 (8), p.2415-2434
Main Authors: Chauhan, Preeti, Zhong, Z. W., Pecht, Michael
Format: Article
Language:English
Subjects:
Adhesive bonding
Applied sciences
Best practice
Bond strength
Characterization and Evaluation of Materials
Chemistry and Materials Science
Copper
Electronics
Electronics and Microelectronics
Exact sciences and technology
Instrumentation
Joining, thermal cutting: metallurgical aspects
Materials
Materials Science
Metals. Metallurgy
Optical and Electronic Materials
Solid State Physics
Wire
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Summary:Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-013-2576-1