Plasma-induced Damages to Polyimide Diaphragms during Si Dry-etching in Micropump Fabrication Processes

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Bibliographic Details
Published in:Journal of Photopolymer Science and Technology 2011/06/21, Vol.24(3), pp.293-298
Main Authors: Liu, Yingwei, Komatsuzaki, Hiroki, Ikoma, Ryuta, Nishioka, Yasuhiro
Format: Article
Language:English
Subjects:
Copper clad laminates
Cover layers
Flexible printed circuit boards
Low-modulus polyimides
Non-flammability
Phosphorus-containing monomers
Poly(ester imide)s
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ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.24.293