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Effect of Heat Treatment on the Thermoelectric Properties of Bismuth–Antimony–Telluride Prepared by Mechanical Deformation and Mechanical Alloying
In this work, p -type 20%Bi 2 Te 3 –80%Sb 2 Te 3 bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstr...
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Published in: | Journal of electronic materials 2014-06, Vol.43 (6), p.2255-2261 |
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Main Authors: | , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | In this work,
p
-type 20%Bi
2
Te
3
–80%Sb
2
Te
3
bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstructure and TE properties of the prepared samples, including Seebeck coefficient, electrical resistivity, thermal conductivity, and figure-of-merit, was investigated. For both samples, saturation of the Seebeck coefficient and electrical resistivity were observed after annealing for 1 h at 380°C. It is suggested that energy stored in samples prepared by both MA and MD facilitated their recrystallization within short annealing times. The 20%Bi
2
Te
3
–80%Sb
2
Te
3
sample prepared by MA followed by heat treatment had higher a Seebeck coefficient and electrical resistivity than specimens fabricated by MD. Maximum figures-of-merit of 3.00 × 10
−3
/K and 2.85 × 10
−3
/K were achieved for samples prepared by MA and MD, respectively. |
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ISSN: | 0361-5235 1543-186X |
DOI: | 10.1007/s11664-014-3037-1 |