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Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak Oxide

This study sought to clarify the relationship between cracks in surface oxide layers and the growth behavior of tin whiskers. The number, length, and total volume of extrusions were precisely calculated and residual stress was measured using synchrotron radiation x-ray diffractometry. The aim was to...

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Bibliographic Details
Published in:Journal of electronic materials 2014-09, Vol.43 (9), p.3290-3295
Main Authors: Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, Liu, Cheng Yi, Ku, Ching-Shun, Wu, Albert T.
Format: Article
Language:English
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Summary:This study sought to clarify the relationship between cracks in surface oxide layers and the growth behavior of tin whiskers. The number, length, and total volume of extrusions were precisely calculated and residual stress was measured using synchrotron radiation x-ray diffractometry. The aim was to elucidate the influence of stress on the driving force and flux involved in atomic diffusion. The distance between weak spots was shown to be the most significant factor involved in the growth of whiskers. The results could explain why increasing the density of the surface weak spots could reduce the number of long whiskers. Measuring the dimensions of whiskers yielded a precise kinetic model capable of describing the migration of atoms to the root of whiskers, resulting in their spontaneous growth.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-014-3182-6