Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

Micro-bumps are now being developed with diameters smaller than 10 μ m. At these dimensions, only very small amounts of solder are used to form the interconnections. Surface oxidation of such small micro-bumps is a critical issue. The key question is whether the oxide film on the solder bumps acts a...

Full description

Saved in:
Bibliographic Details
Published in:Journal of electronic materials 2015-02, Vol.44 (2), p.744-750
Main Authors: Key Chung, C., Zhu, Z. X., Kao, C. R.
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Electronics and Microelectronics
Instrumentation
Materials Science
Optical and Electronic Materials
Soldering
Solid State Physics
Stress analysis
Surface chemistry
Thermal energy
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Micro-bumps are now being developed with diameters smaller than 10 μ m. At these dimensions, only very small amounts of solder are used to form the interconnections. Surface oxidation of such small micro-bumps is a critical issue. The key question is whether the oxide film on the solder bumps acts as a barrier to formation of solder joints. In this work, the mechanical stability of the oxide layer on solder bumps was investigated. Solder bumps with 35- μ m radii were heated for different times. Auger electron spectroscopy was used to determine the thickness of the oxide layer on the solder bumps. Solder bumps with known oxide layer thicknesses were then heated in a low-oxygen environment (
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-014-3528-0