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High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology
The one-time programmable (OTP) cell with intra-Fin-cell-isolation (IFCI) on the FinFET high-k metal gate (HKMG) CMOS process is proposed and demonstrated. The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The...
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Published in: | IEEE electron device letters 2015-10, Vol.36 (10), p.1037-1039 |
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container_end_page | 1039 |
container_issue | 10 |
container_start_page | 1037 |
container_title | IEEE electron device letters |
container_volume | 36 |
creator | Peng, Ping Chun Chen, Yu-Zheng Hsiao, Woan Yun Chen, Kuang-Hsin Lin, Ching-Pin Tien, Bor-Zen Chang, Tzong-Sheng Lin, Chrong Jung King, Ya-Chin |
description | The one-time programmable (OTP) cell with intra-Fin-cell-isolation (IFCI) on the FinFET high-k metal gate (HKMG) CMOS process is proposed and demonstrated. The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The new intra-Fin cell-to-cell isolation eliminates the required wide spacing in the conventional isolation schemes, which successfully shields the neighboring cells from program and read disturbs. Without introducing extra masks or process steps, the CMOS compatible IFCI OTP cell achieves an ultrasmall cell size of 0.076 μm 2 . More than six orders of ON-/OFF-read window is achieved under 4 V programming within 20 μs. |
doi_str_mv | 10.1109/LED.2015.2472300 |
format | article |
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The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The new intra-Fin cell-to-cell isolation eliminates the required wide spacing in the conventional isolation schemes, which successfully shields the neighboring cells from program and read disturbs. Without introducing extra masks or process steps, the CMOS compatible IFCI OTP cell achieves an ultrasmall cell size of 0.076 μm 2 . 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The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The new intra-Fin cell-to-cell isolation eliminates the required wide spacing in the conventional isolation schemes, which successfully shields the neighboring cells from program and read disturbs. Without introducing extra masks or process steps, the CMOS compatible IFCI OTP cell achieves an ultrasmall cell size of 0.076 μm 2 . More than six orders of ON-/OFF-read window is achieved under 4 V programming within 20 μs.</description><subject>Anti-fuse OTP</subject><subject>CMOS integrated circuits</subject><subject>Computer architecture</subject><subject>FinFET</subject><subject>FinFETs</subject><subject>Logic gates</subject><subject>logic NVM</subject><subject>Microprocessors</subject><subject>Nonvolatile memory</subject><issn>0741-3106</issn><issn>1558-0563</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNo9kE1Lw0AQhhdRsFbvgpcFz1t39iObHKUftlCph4o3w9rMtilJtm7SQ_69W1o8DQzPOy_zEPIIfATAs5fldDISHPRIKCMk51dkAFqnjOtEXpMBNwqYBJ7ckru23XMOShk1IN_zcrtjE2zasuvprGxm0zVdNcjWZY30I_htsHVtfyqk71j70NMxVhX9KrsdXTRdsCxm2GnHFq2vbFf6hq5xs2t85bf9Pblxtmrx4TKH5DMWjOdsuXpbjF-XbCMy6JgtCkhUISx3jjtwqRMCpUF0yqZaSqNsojMuNdr4FMgslTryKSTgTOFADsnz-e4h-N8jtl2-98fQxMocTKwwSqciUvxMbYJv24AuP4SytqHPgecni3m0mJ8s5heLMfJ0jpSI-I8bAZkSWv4BgfdsLg</recordid><startdate>201510</startdate><enddate>201510</enddate><creator>Peng, Ping Chun</creator><creator>Chen, Yu-Zheng</creator><creator>Hsiao, Woan Yun</creator><creator>Chen, Kuang-Hsin</creator><creator>Lin, Ching-Pin</creator><creator>Tien, Bor-Zen</creator><creator>Chang, Tzong-Sheng</creator><creator>Lin, Chrong Jung</creator><creator>King, Ya-Chin</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>201510</creationdate><title>High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology</title><author>Peng, Ping Chun ; Chen, Yu-Zheng ; Hsiao, Woan Yun ; Chen, Kuang-Hsin ; Lin, Ching-Pin ; Tien, Bor-Zen ; Chang, Tzong-Sheng ; Lin, Chrong Jung ; King, Ya-Chin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c291t-add164d2a0ff0f1f8f22e37eef4a853374a659035ea15513983564d8161f7df13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Anti-fuse OTP</topic><topic>CMOS integrated circuits</topic><topic>Computer architecture</topic><topic>FinFET</topic><topic>FinFETs</topic><topic>Logic gates</topic><topic>logic NVM</topic><topic>Microprocessors</topic><topic>Nonvolatile memory</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Peng, Ping Chun</creatorcontrib><creatorcontrib>Chen, Yu-Zheng</creatorcontrib><creatorcontrib>Hsiao, Woan Yun</creatorcontrib><creatorcontrib>Chen, Kuang-Hsin</creatorcontrib><creatorcontrib>Lin, Ching-Pin</creatorcontrib><creatorcontrib>Tien, Bor-Zen</creatorcontrib><creatorcontrib>Chang, Tzong-Sheng</creatorcontrib><creatorcontrib>Lin, Chrong Jung</creatorcontrib><creatorcontrib>King, Ya-Chin</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore (Online service)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE electron device letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Peng, Ping Chun</au><au>Chen, Yu-Zheng</au><au>Hsiao, Woan Yun</au><au>Chen, Kuang-Hsin</au><au>Lin, Ching-Pin</au><au>Tien, Bor-Zen</au><au>Chang, Tzong-Sheng</au><au>Lin, Chrong Jung</au><au>King, Ya-Chin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology</atitle><jtitle>IEEE electron device letters</jtitle><stitle>LED</stitle><date>2015-10</date><risdate>2015</risdate><volume>36</volume><issue>10</issue><spage>1037</spage><epage>1039</epage><pages>1037-1039</pages><issn>0741-3106</issn><eissn>1558-0563</eissn><coden>EDLEDZ</coden><abstract>The one-time programmable (OTP) cell with intra-Fin-cell-isolation (IFCI) on the FinFET high-k metal gate (HKMG) CMOS process is proposed and demonstrated. The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The new intra-Fin cell-to-cell isolation eliminates the required wide spacing in the conventional isolation schemes, which successfully shields the neighboring cells from program and read disturbs. Without introducing extra masks or process steps, the CMOS compatible IFCI OTP cell achieves an ultrasmall cell size of 0.076 μm 2 . More than six orders of ON-/OFF-read window is achieved under 4 V programming within 20 μs.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LED.2015.2472300</doi><tpages>3</tpages></addata></record> |
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subjects | Anti-fuse OTP CMOS integrated circuits Computer architecture FinFET FinFETs Logic gates logic NVM Microprocessors Nonvolatile memory |
title | High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology |
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