Properties and Formation of the Structure of Bi^sub 2^Se^sub 0.3^Te^sub 2.7^ Solid Solutions Produced by Equal-Channel Angular Pressing

Issue Title: Special Sections: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII; and Advanced Materials for Power Electronics and Power Conditioning Systems This paper...

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Bibliographic Details
Published in:Journal of electronic materials 2016-01, Vol.45 (1), p.403
Main Authors: Bogomolov, D I, Bublik, V T, Tabachkova, N Yu, Tarasova, I V
Format: Article
Language:English
Subjects:
Defects
Deformation
Diffraction
Electric power
Scanning electron microscopy
Solid solutions
Thermodynamics
Online Access:Get full text
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Summary:Issue Title: Special Sections: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII; and Advanced Materials for Power Electronics and Power Conditioning Systems This paper reports an x-ray diffraction, scanning and transmission electron microscopy study of regularities in the formation of defect structures in thermoelectric materials at different stages of plastic flow during equal-channel angular pressing in a three-channel configuration. We show that this deformation setup produces a homogeneous fine-grain structure with a preferential texture in which grain cleavage planes arrange along the extrusion axis. These studies of the structure and properties of thermoelectric materials were used to choose the optimum temperature for equal-channel angular pressing corresponding to lower pre-recrystallization temperatures.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-015-4110-0