Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode

A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (...

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Bibliographic Details
Published in:Denki kagaku oyobi kōgyō butsuri kagaku 2016/12/05, Vol.84(12), pp.971-977
Main Authors: HORIUCHI, Yoshio, SUZUKI, Yohei, NOH, Joo-hyong, HONMA, Hideo, TAKAI, Osamu, CORDONIER, Christopher E. J.
Format: Article
Language:English
Subjects:
Adsorption
Catalysts
Copper
Electrochemistry
Electroless copper plating
Electroless Plating
Fully-additive Process
Indium tin oxides
Nanostructure
Palladium
Photoelectron spectroscopy
Selectivity
Spectroscopy
Surface chemistry
Surface properties
Tin
Transparent Conductive Films
UV Modification
X ray photoelectron spectroscopy
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Summary:A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (XPS) and surface energy analysis. UV-modified surfaces were created with a polar protic moiety enriched surface that was roughened on the nanometer scale. Furthermore, amplified palladium adsorption selectivity at the modified regions and suppressed deposition on non-modified substrate regions enhanced the resolution. Copper mesh pattern formed on the palladium catalyst pattern achieved lower sheet resistance than indium tin-doped oxide (ITO) film of the same total light transmittance. After annealing the electrolytic plated film, the vertical peel strength between the PEN film and copper deposit was enhanced.
ISSN:1344-3542
2186-2451
DOI:10.5796/electrochemistry.84.971