Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode

A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (...

Full description

Saved in:
Bibliographic Details
Published in:Denki kagaku oyobi kōgyō butsuri kagaku 2016/12/05, Vol.84(12), pp.971-977
Main Authors: HORIUCHI, Yoshio, SUZUKI, Yohei, NOH, Joo-hyong, HONMA, Hideo, TAKAI, Osamu, CORDONIER, Christopher E. J.
Format: Article
Language:English
Subjects:
Adsorption
Catalysts
Copper
Electrochemistry
Electroless copper plating
Electroless Plating
Fully-additive Process
Indium tin oxides
Nanostructure
Palladium
Photoelectron spectroscopy
Selectivity
Spectroscopy
Surface chemistry
Surface properties
Tin
Transparent Conductive Films
UV Modification
X ray photoelectron spectroscopy
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3
cites cdi_FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3
container_end_page 977
container_issue 12
container_start_page 971
container_title Denki kagaku oyobi kōgyō butsuri kagaku
container_volume 84
creator HORIUCHI, Yoshio
SUZUKI, Yohei
NOH, Joo-hyong
HONMA, Hideo
TAKAI, Osamu
CORDONIER, Christopher E. J.
description A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (XPS) and surface energy analysis. UV-modified surfaces were created with a polar protic moiety enriched surface that was roughened on the nanometer scale. Furthermore, amplified palladium adsorption selectivity at the modified regions and suppressed deposition on non-modified substrate regions enhanced the resolution. Copper mesh pattern formed on the palladium catalyst pattern achieved lower sheet resistance than indium tin-doped oxide (ITO) film of the same total light transmittance. After annealing the electrolytic plated film, the vertical peel strength between the PEN film and copper deposit was enhanced.
doi_str_mv 10.5796/electrochemistry.84.971
format article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_1846139191</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1846139191</sourcerecordid><originalsourceid>FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3</originalsourceid><addsrcrecordid>eNptkVFLwzAUhYMoOKa_wYDPnU3SJumjjE2FiZNNX0OW3riOtqlJJvTfW53uQXy5Fy7fOQfOReiKpJNcFPwGajDRO7OFpgrR9xOZTQpBTtCIEskTmuXkFI0Iy7KE5Rk9R5ch7NI0JWnBC1qMUL_6tqg-AM8OXjWEgJe1jlX7hl2LX16TxpWVraDES1f3DXg8r-oGr_beagN4qWME3wYcHZ473-Cp67oBeoSwxTpgjddet6HTHtr4m1LCBTqzug5w-bPH6GU-W0_vk8XT3cP0dpGYPJcxISSX3NCccks2vBTMgpUiB6MlG-5QUlsyKygvYCMyAYJRVmpIyXCSdKPZGF0ffDvv3vcQotq5vW-HSEVkxgkrSEEGShwo410IHqzqfNVo3yuSqq-q1d-qlczUUPWgfD4odyHqNzjqtI-VqeFfHaHfk6vZ8AtJj6zZaq-gZZ9T5ZaR</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1846139191</pqid></control><display><type>article</type><title>Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode</title><source>J-STAGE Free - English</source><creator>HORIUCHI, Yoshio ; SUZUKI, Yohei ; NOH, Joo-hyong ; HONMA, Hideo ; TAKAI, Osamu ; CORDONIER, Christopher E. J.</creator><creatorcontrib>HORIUCHI, Yoshio ; SUZUKI, Yohei ; NOH, Joo-hyong ; HONMA, Hideo ; TAKAI, Osamu ; CORDONIER, Christopher E. J.</creatorcontrib><description>A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (XPS) and surface energy analysis. UV-modified surfaces were created with a polar protic moiety enriched surface that was roughened on the nanometer scale. Furthermore, amplified palladium adsorption selectivity at the modified regions and suppressed deposition on non-modified substrate regions enhanced the resolution. Copper mesh pattern formed on the palladium catalyst pattern achieved lower sheet resistance than indium tin-doped oxide (ITO) film of the same total light transmittance. After annealing the electrolytic plated film, the vertical peel strength between the PEN film and copper deposit was enhanced.</description><identifier>ISSN: 1344-3542</identifier><identifier>EISSN: 2186-2451</identifier><identifier>DOI: 10.5796/electrochemistry.84.971</identifier><language>eng</language><publisher>Tokyo: The Electrochemical Society of Japan</publisher><subject>Adsorption ; Catalysts ; Copper ; Electrochemistry ; Electroless copper plating ; Electroless Plating ; Fully-additive Process ; Indium tin oxides ; Nanostructure ; Palladium ; Photoelectron spectroscopy ; Selectivity ; Spectroscopy ; Surface chemistry ; Surface properties ; Tin ; Transparent Conductive Films ; UV Modification ; X ray photoelectron spectroscopy</subject><ispartof>Electrochemistry, 2016/12/05, Vol.84(12), pp.971-977</ispartof><rights>2016 The Electrochemical Society of Japan</rights><rights>Copyright Japan Science and Technology Agency 2016</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3</citedby><cites>FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1882,27924,27925</link.rule.ids></links><search><creatorcontrib>HORIUCHI, Yoshio</creatorcontrib><creatorcontrib>SUZUKI, Yohei</creatorcontrib><creatorcontrib>NOH, Joo-hyong</creatorcontrib><creatorcontrib>HONMA, Hideo</creatorcontrib><creatorcontrib>TAKAI, Osamu</creatorcontrib><creatorcontrib>CORDONIER, Christopher E. J.</creatorcontrib><title>Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode</title><title>Denki kagaku oyobi kōgyō butsuri kagaku</title><addtitle>Electrochemistry</addtitle><description>A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (XPS) and surface energy analysis. UV-modified surfaces were created with a polar protic moiety enriched surface that was roughened on the nanometer scale. Furthermore, amplified palladium adsorption selectivity at the modified regions and suppressed deposition on non-modified substrate regions enhanced the resolution. Copper mesh pattern formed on the palladium catalyst pattern achieved lower sheet resistance than indium tin-doped oxide (ITO) film of the same total light transmittance. After annealing the electrolytic plated film, the vertical peel strength between the PEN film and copper deposit was enhanced.</description><subject>Adsorption</subject><subject>Catalysts</subject><subject>Copper</subject><subject>Electrochemistry</subject><subject>Electroless copper plating</subject><subject>Electroless Plating</subject><subject>Fully-additive Process</subject><subject>Indium tin oxides</subject><subject>Nanostructure</subject><subject>Palladium</subject><subject>Photoelectron spectroscopy</subject><subject>Selectivity</subject><subject>Spectroscopy</subject><subject>Surface chemistry</subject><subject>Surface properties</subject><subject>Tin</subject><subject>Transparent Conductive Films</subject><subject>UV Modification</subject><subject>X ray photoelectron spectroscopy</subject><issn>1344-3542</issn><issn>2186-2451</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNptkVFLwzAUhYMoOKa_wYDPnU3SJumjjE2FiZNNX0OW3riOtqlJJvTfW53uQXy5Fy7fOQfOReiKpJNcFPwGajDRO7OFpgrR9xOZTQpBTtCIEskTmuXkFI0Iy7KE5Rk9R5ch7NI0JWnBC1qMUL_6tqg-AM8OXjWEgJe1jlX7hl2LX16TxpWVraDES1f3DXg8r-oGr_beagN4qWME3wYcHZ473-Cp67oBeoSwxTpgjddet6HTHtr4m1LCBTqzug5w-bPH6GU-W0_vk8XT3cP0dpGYPJcxISSX3NCccks2vBTMgpUiB6MlG-5QUlsyKygvYCMyAYJRVmpIyXCSdKPZGF0ffDvv3vcQotq5vW-HSEVkxgkrSEEGShwo410IHqzqfNVo3yuSqq-q1d-qlczUUPWgfD4odyHqNzjqtI-VqeFfHaHfk6vZ8AtJj6zZaq-gZZ9T5ZaR</recordid><startdate>20161201</startdate><enddate>20161201</enddate><creator>HORIUCHI, Yoshio</creator><creator>SUZUKI, Yohei</creator><creator>NOH, Joo-hyong</creator><creator>HONMA, Hideo</creator><creator>TAKAI, Osamu</creator><creator>CORDONIER, Christopher E. J.</creator><general>The Electrochemical Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7QL</scope><scope>7QO</scope><scope>7QQ</scope><scope>7SC</scope><scope>7SE</scope><scope>7SP</scope><scope>7SR</scope><scope>7TA</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>F28</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>P64</scope></search><sort><creationdate>20161201</creationdate><title>Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode</title><author>HORIUCHI, Yoshio ; SUZUKI, Yohei ; NOH, Joo-hyong ; HONMA, Hideo ; TAKAI, Osamu ; CORDONIER, Christopher E. J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Adsorption</topic><topic>Catalysts</topic><topic>Copper</topic><topic>Electrochemistry</topic><topic>Electroless copper plating</topic><topic>Electroless Plating</topic><topic>Fully-additive Process</topic><topic>Indium tin oxides</topic><topic>Nanostructure</topic><topic>Palladium</topic><topic>Photoelectron spectroscopy</topic><topic>Selectivity</topic><topic>Spectroscopy</topic><topic>Surface chemistry</topic><topic>Surface properties</topic><topic>Tin</topic><topic>Transparent Conductive Films</topic><topic>UV Modification</topic><topic>X ray photoelectron spectroscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>HORIUCHI, Yoshio</creatorcontrib><creatorcontrib>SUZUKI, Yohei</creatorcontrib><creatorcontrib>NOH, Joo-hyong</creatorcontrib><creatorcontrib>HONMA, Hideo</creatorcontrib><creatorcontrib>TAKAI, Osamu</creatorcontrib><creatorcontrib>CORDONIER, Christopher E. J.</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Bacteriology Abstracts (Microbiology B)</collection><collection>Biotechnology Research Abstracts</collection><collection>Ceramic Abstracts</collection><collection>Computer and Information Systems Abstracts</collection><collection>Corrosion Abstracts</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Business File</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Biotechnology and BioEngineering Abstracts</collection><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>HORIUCHI, Yoshio</au><au>SUZUKI, Yohei</au><au>NOH, Joo-hyong</au><au>HONMA, Hideo</au><au>TAKAI, Osamu</au><au>CORDONIER, Christopher E. J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode</atitle><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle><addtitle>Electrochemistry</addtitle><date>2016-12-01</date><risdate>2016</risdate><volume>84</volume><issue>12</issue><spage>971</spage><epage>977</epage><pages>971-977</pages><issn>1344-3542</issn><eissn>2186-2451</eissn><abstract>A fully-additive fine pattern plating process is described for transparent conductive mesh formation on selectively UV-modified films by electroless copper plating. The reactions of surface modification were considered based on chemical and elemental analysis using X-ray photoelectron spectroscopy (XPS) and surface energy analysis. UV-modified surfaces were created with a polar protic moiety enriched surface that was roughened on the nanometer scale. Furthermore, amplified palladium adsorption selectivity at the modified regions and suppressed deposition on non-modified substrate regions enhanced the resolution. Copper mesh pattern formed on the palladium catalyst pattern achieved lower sheet resistance than indium tin-doped oxide (ITO) film of the same total light transmittance. After annealing the electrolytic plated film, the vertical peel strength between the PEN film and copper deposit was enhanced.</abstract><cop>Tokyo</cop><pub>The Electrochemical Society of Japan</pub><doi>10.5796/electrochemistry.84.971</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 1344-3542
ispartof Electrochemistry, 2016/12/05, Vol.84(12), pp.971-977
issn 1344-3542
2186-2451
language eng
recordid cdi_proquest_journals_1846139191
source J-STAGE Free - English
subjects Adsorption
Catalysts
Copper
Electrochemistry
Electroless copper plating
Electroless Plating
Fully-additive Process
Indium tin oxides
Nanostructure
Palladium
Photoelectron spectroscopy
Selectivity
Spectroscopy
Surface chemistry
Surface properties
Tin
Transparent Conductive Films
UV Modification
X ray photoelectron spectroscopy
title Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T05%3A44%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Selective%20Electroless%20Plating%20on%20UV-modified%20Polymer%20Film%20Surface%20Patterns%20to%20Form%20Copper%20Mesh%20as%20a%20Transparent%20Electrode&rft.jtitle=Denki%20kagaku%20oyobi%20k%C5%8Dgy%C5%8D%20butsuri%20kagaku&rft.au=HORIUCHI,%20Yoshio&rft.date=2016-12-01&rft.volume=84&rft.issue=12&rft.spage=971&rft.epage=977&rft.pages=971-977&rft.issn=1344-3542&rft.eissn=2186-2451&rft_id=info:doi/10.5796/electrochemistry.84.971&rft_dat=%3Cproquest_cross%3E1846139191%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c558t-11586c2526f1b6d73fef875eca836c2ed2fd3f7269eb747e7323dae0172682ba3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1846139191&rft_id=info:pmid/&rfr_iscdi=true