Analysis of Strain Localization at High Angle Grain Boundaries During Creep of a Polycrystalline Superalloy Using SEM-Based Digital Image Correlation

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Bibliographic Details
Published in:Microscopy and microanalysis 2016-07, Vol.22 (S3), p.2018-2019
Main Authors: Slone, C.E., Mills, M.J.
Format: Article
Language:English
Subjects:
Deformation
Grain boundaries
Localization
Materials science
Metallography and Microstructural Characterization of Metals
Microscopy
Physical Science Symposia
Superalloys
Temperature
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ISSN:1431-9276
1435-8115
DOI:10.1017/S143192761601093X