Where physics meets chemistry: Thin film deposition from reactive plasmas

• Published in: Frontiers of chemical science and engineering 2016-12, Vol.10 (4), p.441-458
• Main Authors: Michelmore, Andrew, Whittle, Jason D., Bradley, James W., Short, Robert D.
• Format: Article
• Language: English
• Subjects: Chemical reactions; Chemistry; Chemistry and Materials Science; Control surfaces; Industrial Chemistry/Chemical Engineering; Nanotechnology; Plasma; Plasma deposition; Plasma interactions; Plasma physics; Plasmas (physics); Polymer films; Review Article; Substrates; Surface properties; Surface reactions; Thin films
• ISSN: 2095-0179; 2095-0187
• DOI: 10.1007/s11705-016-1598-7

Functionalising surfaces using polymeric thin films is an industrially important field. One technique for achieving nanoscale, controlled surface functionalization is plasma deposition. Plasma deposition has advantages over other surface engineering processes, including that it is solvent free, substrate and geometry independent, and the surface properties of the film can be designed by judicious choice of precursor and plasma conditions. Despite the utility of this method, the mechanisms of plasma polymer growth are generally unknown, and are usually described by chemical (i.e., radical) pathways. In this review, we aim to show that plasma physics drives the chemistry of the plasma phase, and surface-plasma interactions. For example, we show that ionic species can react in the plasma to form larger ions, and also arrive at surfaces with energies greater than 1000 kJ∙mol –1 (>10 eV) and thus facilitate surface reactions that have not been taken into account previously. Thus, improving thin film deposition processes requires an understanding of both physical and chemical processes in plasma.