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Optical parameters, electrical permittivity and I-V characteristics of PVA/Cs^sub 2^CuO2 nanocomposite films for opto-electronic applications

Poly vinyl alcohol (PVA)/cesium doped copper oxide (Cs2CuO2) nano composite films have been fabricated with varying amounts viz., 2, 4, 6 and 8 wt% of Cs2CuO2 nano fillers by environmentally benign solution casting technique. The effect of Cs2CuO2 nanofiller content on structural behaviors of host p...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2017-06, Vol.28 (11), p.8074
Main Authors: Al-gunaid, Murad Q, A, Saeed, Adel M, N, Subramani, Nithin Kundachira, Madhukar, B S, Siddaramaiah
Format: Article
Language:English
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Summary:Poly vinyl alcohol (PVA)/cesium doped copper oxide (Cs2CuO2) nano composite films have been fabricated with varying amounts viz., 2, 4, 6 and 8 wt% of Cs2CuO2 nano fillers by environmentally benign solution casting technique. The effect of Cs2CuO2 nanofiller content on structural behaviors of host polymer have been established by Fourier transform infrared spectroscopic studies, while morphological behaviors by scanning electron microscopy. The optical parameters of PVA/Cs2CuO2 nanocomposite films were deduced by electronic spectral (UV-visible) studies. The refractive index and the optical conductivities of the nanocomposites increased with an increasing in filler dosage. Dielectric properties were studied using LCR-metre. The dielectric constant is decreases with increase in frequency and the contents of nanofiller in PVA matrix. Whereas, both dielectric loss and AC-conductivity increases with frequency and decreases with nanofiller contents. In addition, the current-voltage (I-V) characteristics of the PVA/Cs2CuO2 have been performed at room temperature and the films appeared non-ohmic behavior at higher applied field. The excellent flexibility of PVA/Cs2CuO2 films coupled with enhanced refractive indices with electrical properties support their possible applications in optical display devices and microelectronic applications.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-017-6513-6