Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

In this article, the Signal Integrity performance analysis of mutual coupling reduction with defective ground structures (DGS) in high speed PCBs has been investigated. The performances of these structures are analyzed, in terms of Time domain, Error Vector Magnitude (EVM), eye pattern and timing ji...

Full description

Saved in:
Bibliographic Details
Published in:Wireless personal communications 2017-06, Vol.94 (4), p.3233-3249
Main Authors: Sindhadevi, Muthuramalingam, Malathi, Kanagasabai, Henridass, Arun, Shrivastav, Arun Kumar
Format: Article
Language:English
Subjects:
Circuit boards
Circularity
Communications Engineering
Computer Communication Networks
Coupling
Current distribution
Electromagnetic compatibility
Electronics industry
Emission analysis
Engineering
High speed
Mutual coupling
Networks
Printed circuits
Quadrature phase shift keying
Reduction
Signal integrity
Signal quality
Signal,Image and Speech Processing
Timing jitter
Vibration
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this article, the Signal Integrity performance analysis of mutual coupling reduction with defective ground structures (DGS) in high speed PCBs has been investigated. The performances of these structures are analyzed, in terms of Time domain, Error Vector Magnitude (EVM), eye pattern and timing jitter. A NRZ test signal with Quadrature Phase Shift keying modulation, with a carrier frequency of 3.5 GHz is used for the EVM measurements. From the EVM measurements, it is observed that the PCB with Circular DGS has the lowest EVM of 1.195 % rms compared to other techniques. Further, the eye pattern and jitter analysis show that the circular DGS has the lowest jitter value of 8 ps at 1Gbps data rate. Finally, the electromagnetic compatibility of proposed method is checked with the surface current distribution and radiated emission analysis. These investigations show that the adoption of the circular DGS in the high speed PCB design, reduces the spacing between two traces without degrading the signal quality.
ISSN:0929-6212
1572-834X
DOI:10.1007/s11277-016-3774-y