Heat spreading and heat transfer coefficient with fin heat sink

• Published in: Applied thermal engineering 2017-02, Vol.112, p.1638-1647
• Main Authors: Ong, K.S., Tan, C.F., Lai, K.C., Tan, K.H.
• Format: Article
• Language: English
• Subjects: Air cooling; CFD simulation; Chips; Convection cooling; Convection heating; Cooling fins; Cooling systems; Dissipation; Fin heat sink; Force convection; Heat sinks; Heat transfer; Heat transfer coefficients; Natural convection; Semiconductors; Spreading; Studies; System effectiveness; Thermal energy; Thermal heat spreading; Thermal resistance; Thermoelectricity
• ISSN: 1359-4311; 1873-5606
• DOI: 10.1016/j.applthermaleng.2016.09.161

•Heat transfer coefficients were obtained under natural and force convection.•Two different aspect ratios showed the effects of thermal heat spreading.•A CFD simulation was performed.•Heat transfer coefficients depended upon thermal heat spreading effect. Compact high powered semiconductor chips require greater heat dissipation and more effective thermal cooling systems have to be devised such as incorporating vapor chambers and thermoelectric. As a first step, the performance of two conventional fin heat sinks with flat metal base and an array of cooling fins on top are determined under force and natural convection air cooling and with various heating power input. Fin temperatures and heat transfer coefficients were determined for different size heating elements producing different area aspect ratios. This paper reports on the effect of thermal heat spreading effect and determination of the thermal heat spreading resistance. Heat spreading and contact resistances are small compared to the thermal resistance of the FHS itself.