Thermal and electrical conductivity of a copper–aluminum micro(nano)composite material

The thermal conductivity and volume resistivity of a composition obtained by pressing copper and aluminum micro(nano)powders with subsequent sintering is estimated in terms of an integrated medium theory. Similar composite materials can find use as heatsinks for high-power transistors and diodes.

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Bibliographic Details
Published in:Bulletin of the Russian Academy of Sciences. Physics 2015-11, Vol.79 (11), p.1380-1382
Main Authors: Ataev, I. F., Dedegkaeva, L. M., Manukyants, A. R., Ponezhev, M. Kh, Punis, V. S., Sozaev, V. A.
Format: Article
Language:English
Subjects:
Aluminum
Composite materials
Copper
Diodes
Disorder
Electrical resistivity
Hadrons
Heat sinks
Heat transfer
Heavy Ions
Nuclear Physics
Physics
Physics and Astronomy
Power semiconductor devices
Proceedings of the International Symposium “Ordering in Minerals and Alloys” OMA-17 and Proceedings of the International Symposium “Order
Properties of Oxides” ODPO-17
Semiconductor devices
Sintering
Thermal conductivity
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Description
Summary:The thermal conductivity and volume resistivity of a composition obtained by pressing copper and aluminum micro(nano)powders with subsequent sintering is estimated in terms of an integrated medium theory. Similar composite materials can find use as heatsinks for high-power transistors and diodes.
ISSN:1062-8738
1934-9432
DOI:10.3103/S1062873815110040