Simplified approach for steady thermal analysis of chips with variable power based on spatial autocorrelation

•Approach for steady thermal analysis of chip with variable power is proposed.•The determination of material properties and other factors can be tolerated.•The highest temperature error in the case study is not more than 2%. Due to their growing power and shrinking size, thermal management and analy...

Full description

Saved in:
Bibliographic Details
Published in:Applied thermal engineering 2017-06, Vol.120, p.347-357
Main Authors: Pei, C., Fu, G.C., Zhao, Y.H., Wan, B., Cheng, Y.
Format: Article
Language:English
Subjects:
Analyzers
Autocorrelation
Chips
Electric power distribution
Electronic devices
Finite element method
Heat conductivity
Mathematical analysis
Power devices
Redundancy
Spatial autocorrelation
Steady thermal analysis
Studies
Temperature distribution
Temperature measurement
Thermal analysis
Thermal energy
Thermal management
Uncertainty analysis
Undetermined coefficient method
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:•Approach for steady thermal analysis of chip with variable power is proposed.•The determination of material properties and other factors can be tolerated.•The highest temperature error in the case study is not more than 2%. Due to their growing power and shrinking size, thermal management and analysis have become one of the most critical concerns for power devices. Though finite element (FE) method is commonly employed in thermal analysis now, the uncertainty of material properties and the redundancy of repeat modeling still nag analyzers. In this paper, a simplified approach for steady thermal analysis of chips with variable power is proposed. Based on spatial autocorrelation and undetermined method, the steady temperature distribution could be directly determined with power distribution and example temperature measurement result, without identifying environment factors or material properties. The theory of the simplified approach is introduced at first in this paper. The characteristics of the simplified approach are discussed afterwards. Eventually, a case study is given to illustrate the procedure, of which the analytical result coincides with the actual measurement well.
ISSN:1359-4311
1873-5606
DOI:10.1016/j.applthermaleng.2017.04.010