Mass transfer trends of AlCoCrFeNi high-entropy alloy coatings on TC11 substrate via electrospark − computer numerical control deposition

A new electrospark deposition (ESD) process, electrospark – computer numerical control deposition (ES-CNCD), was proposed based on an ES-computer integrated deposition system (ES-CIDS). The ES-CIDS integrated a 3-axis CNC milling machine with an ESD welder via a passive exsertile/retractable pattern...

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Bibliographic Details
Published in:Journal of materials processing technology 2017-03, Vol.241, p.93-102
Main Authors: Wang, Xiao-Rong, Wang, Zhao-Qin, Lin, Tie-Song, He, Peng
Format: Article
Language:English
Subjects:
Alloys
Coated electrodes
Coatings
Conductivity
Deposition
Deposition strategy
Electrospark - computer numerical control deposition
Electrospark deposition
Entropy
Experiments
High entropy alloys
High-entropy alloy
Mass transfer
Milling (machining)
Numerical controls
Process parameters
Titanium base alloys
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Summary:A new electrospark deposition (ESD) process, electrospark – computer numerical control deposition (ES-CNCD), was proposed based on an ES-computer integrated deposition system (ES-CIDS). The ES-CIDS integrated a 3-axis CNC milling machine with an ESD welder via a passive exsertile/retractable pattern special deposition holder. The ES-CNCD process employs high-current electrical pulses of short duration to modify the metal surface. In this work, an AlCoCrFeNi high-entropy alloy (HEA) was used as the electrode to prepare HEA coatings on TC11 titanium alloy substrate via weld-spot pattern deposition strategy. Three quantities of cathode mass gain (CMG), anode mass gain (AMG) and material transfer coefficient (MTC) were redefined for ES-CNCD process. The impact of process parameters on CMG, AMG, MTC was investigated via designing orthogonal experiments. The physical mode of mass transfer of ES-CNCD process has been proposed and confirmed by experiments.
ISSN:0924-0136
1873-4774
DOI:10.1016/j.jmatprotec.2016.09.012