Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

• Published in: International journal of heat and mass transfer 2017-11, Vol.114, p.613-620
• Main Authors: Illés, Balázs, Skwarek, Agata, Géczy, Attila, Krammer, Olivér, Bušek, David
• Format: Article
• Language: English
• Subjects: Computational fluid dynamics; Computer simulation; Gas void; Heat loss; Heat transfer; Mass transport; Mathematical models; Navier-Stokes equations; Numerical analysis; RANS; Reynolds averaged Navier-Stokes method; Reynolds number; Soldered joints; Soldering; Standard k-ε turbulence method; Studies; Three dimensional flow; Three dimensional models; Transport processes; Turbulence; Vacuum vapour phase soldering; Vapor pressure; Vapors; Vapour concentration
• ISSN: 0017-9310; 1879-2189
• DOI: 10.1016/j.ijheatmasstransfer.2017.06.091

•Numerical modelling of the a Vacuum Vapour Phase Soldering System was done.•Low vapour pressure is applied to decrease the gas voids in the solder joints.•3D flow model was developed with RANS equations and standard k-ε turbulence method.•Vapour suctioning has considerable effects on the heat transfer processes of the soldering.•Heat loss of the soldering chamber during the vapour suctioning can be decreased with appropriate settings. The heat and mass transport processes were investigated with numerical simulations in a vacuum vapour phase soldering system during the vapour suctioning process. Low vapour pressure/concentration is applied during vacuum soldering to decrease the number of gas voids in the solder joints. Three-dimensional numerical flow model was developed which based on the Reynolds averaged Navier-Stokes equations with the standard k-ε turbulence method. The decrease of the vapour concentration and its effects on the solder joints were studied in the case of different oven settings. It was found that vapour suctioning has considerable effects on the heat transfer processes in the soldering chamber which might lead to early solidification of the solder joints and reduces the efficiency of the void removal. Different oven settings were simulated in order to decrease the heat loss of the soldering chamber during the vapour suctioning. It was shown that with appropriate setting of the vacuum vapour phase soldering technology, the efficiency of the void removal can be increased.