Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process

The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperat...

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Bibliographic Details
Published in:Journal of alloys and compounds 2017-11, Vol.725, p.818-823
Main Authors: Mathew, Rohit T., Mule, Dayanand, Balasubramaniam, K.R., Prasad, M.J.N.V.
Format: Article
Language:English
Subjects:
Alloys
Bonding strength
Cladding
Claddings
Composite
Copper
Deformation
Microstructural analysis
Microstructure
Multilayers
Roll bonding
Temperature
Tensile strength
Tensile test
Tin
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Summary:The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperature. Room temperature tensile response of the trimetallic layered clad involves a two-stage deformation behavior with typical composite strengthening. Microstructural analysis suggests that dynamic deformation activities such occurring in Sn can control the tensile behavior of the trimetallic claddings. [Display omitted] •A trimetallic Cu/Sn/Zn clad is fabricated by roll bonding process.•The Cu/Sn/Zn clad exhibited two-stage stress-strain behavior in tension.•Dynamic recrystallization and grain growth in Sn controls the deformation of clad.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2017.07.205