Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process

The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperat...

Full description

Saved in:
Bibliographic Details
Published in:Journal of alloys and compounds 2017-11, Vol.725, p.818-823
Main Authors: Mathew, Rohit T., Mule, Dayanand, Balasubramaniam, K.R., Prasad, M.J.N.V.
Format: Article
Language:English
Subjects:
Alloys
Bonding strength
Cladding
Claddings
Composite
Copper
Deformation
Microstructural analysis
Microstructure
Multilayers
Roll bonding
Temperature
Tensile strength
Tensile test
Tin
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783
cites cdi_FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783
container_end_page 823
container_issue
container_start_page 818
container_title Journal of alloys and compounds
container_volume 725
creator Mathew, Rohit T.
Mule, Dayanand
Balasubramaniam, K.R.
Prasad, M.J.N.V.
description The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperature. Room temperature tensile response of the trimetallic layered clad involves a two-stage deformation behavior with typical composite strengthening. Microstructural analysis suggests that dynamic deformation activities such occurring in Sn can control the tensile behavior of the trimetallic claddings. [Display omitted] •A trimetallic Cu/Sn/Zn clad is fabricated by roll bonding process.•The Cu/Sn/Zn clad exhibited two-stage stress-strain behavior in tension.•Dynamic recrystallization and grain growth in Sn controls the deformation of clad.
doi_str_mv 10.1016/j.jallcom.2017.07.205
format article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_1967364856</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0925838817325811</els_id><sourcerecordid>1967364856</sourcerecordid><originalsourceid>FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783</originalsourceid><addsrcrecordid>eNqFUMtKxDAUDaLg-PgEIeC6M0nTNMlKZPAFigt14yakt7eaUhtNWsG_N2XcuzqL8-IcQs44W3PG602_7t0wQPhYl4yrNVMZ5R5Zca1EUdW12ScrZkpZaKH1ITlKqWeMcSP4inQPHmJIU5xhmiNSN7Z0wjH5AWmD7-7bh0hDR7fz5mncvI50iv4Dp9zngcLg2taPb4l-xtDOgC1tfmgMw0CbMC7MQgCmdEIOOjckPP3DY_JyffW8vS3uH2_utpf3BQihpkI22CjplDaNQYFoaim50o1jElTFWKmwcoCmbbXRAkQJvClBQeWEgE5pcUzOd7m592vGNNk-zHHMlZabWom60rLOKrlTLdNTxM5-5lUu_ljO7HKp7e3fpXa51DKVUWbfxc6HecK3x2gTeBzzbh8RJtsG_0_CLxWgg74</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1967364856</pqid></control><display><type>article</type><title>Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process</title><source>ScienceDirect Freedom Collection</source><creator>Mathew, Rohit T. ; Mule, Dayanand ; Balasubramaniam, K.R. ; Prasad, M.J.N.V.</creator><creatorcontrib>Mathew, Rohit T. ; Mule, Dayanand ; Balasubramaniam, K.R. ; Prasad, M.J.N.V.</creatorcontrib><description>The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperature. Room temperature tensile response of the trimetallic layered clad involves a two-stage deformation behavior with typical composite strengthening. Microstructural analysis suggests that dynamic deformation activities such occurring in Sn can control the tensile behavior of the trimetallic claddings. [Display omitted] •A trimetallic Cu/Sn/Zn clad is fabricated by roll bonding process.•The Cu/Sn/Zn clad exhibited two-stage stress-strain behavior in tension.•Dynamic recrystallization and grain growth in Sn controls the deformation of clad.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2017.07.205</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Alloys ; Bonding strength ; Cladding ; Claddings ; Composite ; Copper ; Deformation ; Microstructural analysis ; Microstructure ; Multilayers ; Roll bonding ; Temperature ; Tensile strength ; Tensile test ; Tin</subject><ispartof>Journal of alloys and compounds, 2017-11, Vol.725, p.818-823</ispartof><rights>2017 Elsevier B.V.</rights><rights>Copyright Elsevier BV Nov 25, 2017</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783</citedby><cites>FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783</cites><orcidid>0000-0002-6454-9284 ; 0000-0003-4651-6419</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids></links><search><creatorcontrib>Mathew, Rohit T.</creatorcontrib><creatorcontrib>Mule, Dayanand</creatorcontrib><creatorcontrib>Balasubramaniam, K.R.</creatorcontrib><creatorcontrib>Prasad, M.J.N.V.</creatorcontrib><title>Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process</title><title>Journal of alloys and compounds</title><description>The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperature. Room temperature tensile response of the trimetallic layered clad involves a two-stage deformation behavior with typical composite strengthening. Microstructural analysis suggests that dynamic deformation activities such occurring in Sn can control the tensile behavior of the trimetallic claddings. [Display omitted] •A trimetallic Cu/Sn/Zn clad is fabricated by roll bonding process.•The Cu/Sn/Zn clad exhibited two-stage stress-strain behavior in tension.•Dynamic recrystallization and grain growth in Sn controls the deformation of clad.</description><subject>Alloys</subject><subject>Bonding strength</subject><subject>Cladding</subject><subject>Claddings</subject><subject>Composite</subject><subject>Copper</subject><subject>Deformation</subject><subject>Microstructural analysis</subject><subject>Microstructure</subject><subject>Multilayers</subject><subject>Roll bonding</subject><subject>Temperature</subject><subject>Tensile strength</subject><subject>Tensile test</subject><subject>Tin</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNqFUMtKxDAUDaLg-PgEIeC6M0nTNMlKZPAFigt14yakt7eaUhtNWsG_N2XcuzqL8-IcQs44W3PG602_7t0wQPhYl4yrNVMZ5R5Zca1EUdW12ScrZkpZaKH1ITlKqWeMcSP4inQPHmJIU5xhmiNSN7Z0wjH5AWmD7-7bh0hDR7fz5mncvI50iv4Dp9zngcLg2taPb4l-xtDOgC1tfmgMw0CbMC7MQgCmdEIOOjckPP3DY_JyffW8vS3uH2_utpf3BQihpkI22CjplDaNQYFoaim50o1jElTFWKmwcoCmbbXRAkQJvClBQeWEgE5pcUzOd7m592vGNNk-zHHMlZabWom60rLOKrlTLdNTxM5-5lUu_ljO7HKp7e3fpXa51DKVUWbfxc6HecK3x2gTeBzzbh8RJtsG_0_CLxWgg74</recordid><startdate>20171125</startdate><enddate>20171125</enddate><creator>Mathew, Rohit T.</creator><creator>Mule, Dayanand</creator><creator>Balasubramaniam, K.R.</creator><creator>Prasad, M.J.N.V.</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><orcidid>https://orcid.org/0000-0002-6454-9284</orcidid><orcidid>https://orcid.org/0000-0003-4651-6419</orcidid></search><sort><creationdate>20171125</creationdate><title>Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process</title><author>Mathew, Rohit T. ; Mule, Dayanand ; Balasubramaniam, K.R. ; Prasad, M.J.N.V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Alloys</topic><topic>Bonding strength</topic><topic>Cladding</topic><topic>Claddings</topic><topic>Composite</topic><topic>Copper</topic><topic>Deformation</topic><topic>Microstructural analysis</topic><topic>Microstructure</topic><topic>Multilayers</topic><topic>Roll bonding</topic><topic>Temperature</topic><topic>Tensile strength</topic><topic>Tensile test</topic><topic>Tin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mathew, Rohit T.</creatorcontrib><creatorcontrib>Mule, Dayanand</creatorcontrib><creatorcontrib>Balasubramaniam, K.R.</creatorcontrib><creatorcontrib>Prasad, M.J.N.V.</creatorcontrib><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Mathew, Rohit T.</au><au>Mule, Dayanand</au><au>Balasubramaniam, K.R.</au><au>Prasad, M.J.N.V.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2017-11-25</date><risdate>2017</risdate><volume>725</volume><spage>818</spage><epage>823</epage><pages>818-823</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>The roll bonding process facilitates the top-down approach to the fabrication of multilayered alloys and composites from unusual combinations of metals. We demonstrate the application of the roll bonding process to produce trimetallic Cu/Sn/Zn layered cladding with strong interfaces at room temperature. Room temperature tensile response of the trimetallic layered clad involves a two-stage deformation behavior with typical composite strengthening. Microstructural analysis suggests that dynamic deformation activities such occurring in Sn can control the tensile behavior of the trimetallic claddings. [Display omitted] •A trimetallic Cu/Sn/Zn clad is fabricated by roll bonding process.•The Cu/Sn/Zn clad exhibited two-stage stress-strain behavior in tension.•Dynamic recrystallization and grain growth in Sn controls the deformation of clad.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2017.07.205</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0002-6454-9284</orcidid><orcidid>https://orcid.org/0000-0003-4651-6419</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 0925-8388
ispartof Journal of alloys and compounds, 2017-11, Vol.725, p.818-823
issn 0925-8388
1873-4669
language eng
recordid cdi_proquest_journals_1967364856
source ScienceDirect Freedom Collection
subjects Alloys
Bonding strength
Cladding
Claddings
Composite
Copper
Deformation
Microstructural analysis
Microstructure
Multilayers
Roll bonding
Temperature
Tensile strength
Tensile test
Tin
title Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T05%3A08%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microstructure%20and%20tensile%20behavior%20of%20Cu/Sn/Zn%20trimetallic%20claddings%20produced%20by%20roll%20bonding%20process&rft.jtitle=Journal%20of%20alloys%20and%20compounds&rft.au=Mathew,%20Rohit%20T.&rft.date=2017-11-25&rft.volume=725&rft.spage=818&rft.epage=823&rft.pages=818-823&rft.issn=0925-8388&rft.eissn=1873-4669&rft_id=info:doi/10.1016/j.jallcom.2017.07.205&rft_dat=%3Cproquest_cross%3E1967364856%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c337t-5beb75a789b9e3ee9655178ba05c740027e4ace9dd8983c32c1b2c7c4a33cf783%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1967364856&rft_id=info:pmid/&rfr_iscdi=true