Design Guideline for New Generation of High-Temperature Guarded Hot Plate

This paper complements the existing measurement standards and literature for high-temperature guarded hot plates (HTGHPs) by addressing specific issues relating to thermal conductivity measurement of technical insulation at high temperatures. The examples given are focused on the designs of HTGHPs f...

Full description

Saved in:
Bibliographic Details
Published in:International journal of thermophysics 2018-02, Vol.39 (2), p.1-21, Article 23
Main Authors: Wu, J., Hameury, J., Failleau, G., Blahut, A., Vachova, T., Strnad, R., Krause, M., Rafeld, E., Hammerschmidt, U.
Format: Article
Language:English
Subjects:
Classical Mechanics
Condensed Matter Physics
Configuration management
Cross-sections
Flatness
Geophysics
Heat conductivity
Heat transfer
Humidity
Industrial Chemistry/Chemical Engineering
Moisture and Thermal Measurements in Industry and Science
Physical Chemistry
Physics
Physics and Astronomy
Stress analysis
Temperature
Temperature sensors
Tempmeko 2016
TEMPMEKO 2016: Selected Papers of the 13th International Symposium on Temperature
Thermal conductivity
Thermal expansion
Thermal insulation
Thermal resistance
Thermal stress
Thermodynamics
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper complements the existing measurement standards and literature for high-temperature guarded hot plates (HTGHPs) by addressing specific issues relating to thermal conductivity measurement of technical insulation at high temperatures. The examples given are focused on the designs of HTGHPs for measuring thin thermal insulation. The sensitivity studies have been carried out on major influencing factors that affect the thermal conductivity measurements using HTGHPs, e.g., the uncertainty of temperature measurements, plate flatness and center-guard gap design and imbalance. A new configuration of center-guard gap with triangular shape cross section has been optimized to obtain the same thermal resistance as a 2 mm wide gap with rectangular shape cross section that has been used in the HTGHPs at NPL and LNE. Recommendations have been made on the selections of heater plate materials, high-temperature high-emissivity coatings and miniature temperature sensors. For the first time, thermal stress analysis method has been applied to the field of HTGHPs, in order to estimate the effect of differential thermal expansion on the flatness of thin rigid specimens during thermal conductivity tests in a GHP.
ISSN:0195-928X
1572-9567
DOI:10.1007/s10765-017-2344-1