Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

Cu-Sn solid–liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu 6 Sn 5 and Cu 3 Sn SLID-bonded joints were compared. The intermetallic...

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Bibliographic Details
Published in:Journal of electronic materials 2018-01, Vol.47 (1), p.430-435
Main Authors: Lee, Byung-Suk, Yoon, Jeong-Won
Format: Article
Language:English
Subjects:
Bonded joints
Bonding strength
Characterization and Evaluation of Materials
Chemical bonds
Chemistry and Materials Science
Copper
Electronics
Electronics and Microelectronics
Instrumentation
Interdiffusion
Intermetallic compounds
Materials research
Materials Science
Mechanical properties
Optical and Electronic Materials
Shear strength
Solid State Physics
Thermodynamic properties
Tin compounds
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Summary:Cu-Sn solid–liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu 6 Sn 5 and Cu 3 Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu 3 Sn SLID-bonded joint was superior to the conventional solder and the Cu 6 Sn 5 SLID-bonded joints.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-017-5792-2