Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

• Published in: Journal of electronic materials 2018-01, Vol.47 (1), p.811-819
• Main Authors: Pei, Chun, Chen, Chuantong, Suganuma, Katsuaki, Fu, Guicui
• Format: Article
• Language: English
• Subjects: Aluminum; Characterization and Evaluation of Materials; Chemistry and Materials Science; Coating; Copper; Electron microscopy; Electronics and Microelectronics; Flakes; Fracture mechanics; Instrumentation; Magnetron sputtering; Materials research; Materials Science; Nickel plating; Optical and Electronic Materials; Scanning electron microscopy; Shear strength; Silicon; Silver; Sintering; Solid State Physics; Substrates; Surface analysis (chemical); Thermal stability; Titanium
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-017-5857-2

The thermal stability of silver (Ag) paste sintering on coated copper (Cu) and aluminum (Al) substrates has been investigated. Instead of conventional zincating or nickel plating, magnetron sputtering was used to achieve coating with titanium (Ti) and Ag. Silicon (Si) chips were bonded to coated Cu and Al substrates using a mixture of submicron Ag flakes and particles under 250°C and 0.4 MPa for 30 min. The joints were then subject to aging testing at 250°C for duration of 200 h, 500 h, and 1000 h. Two types of joints exhibited satisfactory initial shear strength above 45 MPa. However, the shear strength of the joints on Al substrate decreased to 28 MPa after 1000 h of aging, while no shear strength decline was detected for the joints on Cu substrate. Fracture surface analysis revealed that the vulnerable points of the two types of joints were (1) the Ag layer and (2) the interface between the Ti layer and Cu substrate. Based on the results of scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS), and simulations, cracks in the Ag layer were identified as the cause of the shear strength degradation in the joints on Al substrate. The interface evolution of the joints on Cu substrate was ascribed to Cu migration and discontinuity points that initialized in the Ti layer. This study reveals that Al exhibited superior thermal stability with sintered Ag paste.