Cantilever testing of sintered-silver interconnects

• Published in: Journal of materials science. Materials in electronics 2018, Vol.29 (2), p.1530-1541
• Main Authors: Wereszczak, Andrew A., Chen, Branndon R., Jadaan, Osama M., Oistad, Brian A., Modugno, Max C., Sharp, Jeffrey W., Salvador, James R.
• Format: Article
• Language: English
• Subjects: Beam theory (structures); Bonded joints; Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Electronic components; Electronic devices; Failure analysis; Gold; Interconnections; Materials Science; Mathematical analysis; Mechanical tests; Nickel; Optical and Electronic Materials; Shear; Shear stress; Silver; Sintering; Stresses; Substrates; Test methods; Titanium
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-017-8063-3

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimations of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. The experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.