Analysis of counter flow of corona wind for heat transfer enhancement

• Published in: Heat and mass transfer 2018-03, Vol.54 (3), p.841-854
• Main Authors: Shin, Dong Ho, Baek, Soo Hong, Ko, Han Seo
• Format: Article
• Language: English
• Subjects: Central processing units; Cooling; Cooling effects; CPUs; Electronic devices; Engineering; Engineering Thermodynamics; Fins; Forced convection; Heat and Mass Transfer; Heat flux; Heat transfer coefficients; Industrial Chemistry/Chemical Engineering; Original; Product design; Thermodynamics; Windpowered generators
• ISSN: 0947-7411; 1432-1181
• DOI: 10.1007/s00231-017-2183-4

A heat sink for cooling devices using the counter flow of a corona wind was developed in this study. Detailed information about the numerical investigations of forced convection using the corona wind was presented. The fins of the heat sink using the counter flow of a corona wind were also investigated. The corona wind generator with a wire-to-plate electrode arrangement was used for generating the counter flow to the fin. The compact and simple geometric characteristics of the corona wind generator facilitate the application of the heat sink using the counter flow, demonstrating the heat sink is effective for cooling electronic devices. Parametric studies were performed to analyze the effect of the counter flow on the fins. Also, the velocity and temperature were measured experimentally for the test mock-up of the heat sink with the corona wind generator to verify the numerical results. From a numerical study, the type of fin and its optimal height, length, and pitch were suggested for various heat fluxes. In addition, the correlations to calculate the mass of the developed heat sink and its cooling performance in terms of the heat transfer coefficient were derived. Finally, the cooling efficiencies corresponding to the mass, applied power, total size, and noise of the devices were compared with the existing commercial central processing unit (CPU) cooling devices with rotor fans. As a result, it was confirmed that the heat sink using the counter flow of the corona wind showed appropriate efficiencies for cooling electronic devices, and is a suitable replacement for the existing cooling device for high power electronics.