Optical cyber-physical system embedded on an FPGA for 3D measurement in structural health monitoring tasks

This paper presents the description of a cyber-physical system embedded on an FPGA for 3D measurement in structural health monitoring tasks. The implementation technique and performance evaluation demonstrate the contribution of this paper to the mathematical fundamentals adaptation of an on-site ro...

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Bibliographic Details
Published in:Microprocessors and microsystems 2018-02, Vol.56, p.121-133
Main Authors: Miranda-Vega, Jesús Elías, Flores-Fuentes, Wendy, Sergiyenko, Oleg, Rivas-López, Moisés, Lindner, Lars, Rodríguez-Quiñonez, Julio C., Hernández-Balbuena, Daniel
Format: Article
Language:English
Subjects:
Angle measurement
Cyber-physical system
Data analysis
Data exchange
Embedded system
Embedded systems
Field programmable gate array
Field programmable gate arrays
Optoelectronic signal
Optoelectronics
Performance evaluation
Real time
Remote observing
Scanning
Soft sensing
Structural health monitoring
Studies
Virtual sensor
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Summary:This paper presents the description of a cyber-physical system embedded on an FPGA for 3D measurement in structural health monitoring tasks. The implementation technique and performance evaluation demonstrate the contribution of this paper to the mathematical fundamentals adaptation of an on-site rotatory scanning system to a cyber-physical system. In particular, it is described in detail the design of a virtual angle measurement soft sensing technique based on the information conversion of an optoelectronic signal provided by a rotatory scanning system through an FPGA. Behaving the FPGA as the sensor controller and the actuator in the scanning system. Using the measurement of angles through the proposed embedded system, it can be calculated the coordinates and displacement of specific indicators distributed over a structure under observation. Providing online data exchange from on-site measurement to a remote computational station for real-time or posteriorly data analysis.
ISSN:0141-9331
1872-9436
DOI:10.1016/j.micpro.2017.11.005