Multiscale thermal modeling of cured cycloaliphatic epoxy/carbon fiber composites

ABSTRACT Cycloaliphatic epoxies (CEs) are commonly used for structural applications requiring improved resistance to elevated temperatures, UV radiation, and moisture relative to other epoxy materials. Accurate and efficient computational models can greatly facilitate the development of CE‐based com...

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Bibliographic Details
Published in:Journal of applied polymer science 2018-07, Vol.135 (25), p.n/a
Main Authors: Chinkanjanarot, Sorayot, Radue, Matthew S., Gowtham, S., Tomasi, Julie M., Klimek‐McDonald, Danielle R., King, Julia A., Odegard, Gregory M.
Format: Article
Language:English
Subjects:
Aluminum
Carbon fiber reinforced plastics
Carbon-epoxy composites
Composite materials
Conductors
Crosslinking
Fiber composites
glass transition
Heat conductivity
Heat transfer
High temperature
Materials science
Mathematical models
Moisture resistance
Multiscale analysis
Polymers
Power lines
Predictions
resins
theory and modeling
Thermal analysis
Thermal conductivity
Thermal expansion
thermal properties
Thermodynamic properties
thermosets
Transition temperature
Ultraviolet radiation
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Summary:ABSTRACT Cycloaliphatic epoxies (CEs) are commonly used for structural applications requiring improved resistance to elevated temperatures, UV radiation, and moisture relative to other epoxy materials. Accurate and efficient computational models can greatly facilitate the development of CE‐based composite materials for applications such as Aluminum Conductor Composite Core high‐voltage power lines. In this study, a new multiscale modeling method is developed for CE resins and composite materials to efficiently predict thermal properties (glass‐transition temperature, thermal expansion coefficient, and thermal conductivity). The predictions are compared to experimental data, and the results indicate that the multiscale modeling method can accurately predict thermal properties for CE‐based materials. For 85% crosslink densities, the predicted glass‐transition temperature, thermal expansion coefficient, and thermal conductivity are 279 °C, 109 ppm °C−1, 0.24 W m−1 K−1, respectively. Thus, this multiscale modeling method can be used for the future development of improved CE composite materials for thermal applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46371.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.46371