Dictating anisotropic electric conductivity of a transparent copper nanowire coating by the surface structure of wood

In this article, a robust, air-stable, flexible and transparent copper (Cu) nanowire (NW) network coating on the surface of the wood is presented, based on a fusion welding of the Cu NWs by photonic curing. Thereby, an anisotropic conductivity can be achieved, which is originating from the structura...

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Bibliographic Details
Published in:Journal of the Royal Society interface 2018-05, Vol.15 (142), p.20170864-20170864
Main Authors: Guo, Huizhang, Büchel, Martin, Li, Xing, Wäckerlin, Aneliia, Chen, Qing, Burgert, Ingo
Format: Article
Language:English
Subjects:
Anisotropic Conductivity
Antioxidation
Biomaterials
Biomedical materials
Conductivity
Conductors
Copper
Corrosion resistance
Cu Nws
Electrical resistivity
Electronic devices
Electronic equipment
Fusion welding
Hydrophobicity
Life Sciences–Engineering interface
Nanotechnology
Nanowires
Oxidation
Paraffin
Paraffin wax
Photonics
Polyolefins
Protective coatings
Renewable resources
Repellency
Smart buildings
Substrates
Surface structure
Surface water
Sustainable yield
Wood
Wood Surface
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Summary:In this article, a robust, air-stable, flexible and transparent copper (Cu) nanowire (NW) network coating on the surface of the wood is presented, based on a fusion welding of the Cu NWs by photonic curing. Thereby, an anisotropic conductivity can be achieved, which is originating from the structural organization of the wood body and its surface. Furthermore, the Cu NWs are protected from oxidation or wear by a commercially available paraffin wax—polyolefin, which also results in surface water repellency. The developed processing steps present a facile and flexible routine for applying Cu NW transparent conductors to abundant biomaterials and solve current manufacturing obstacles for corrosion-resistant circuits while keeping the natural appearance of the substrate. It may open a venue for more extensive utilization of materials from renewable resources such as wood for electronic devices in smart buildings or mobility applications.
ISSN:1742-5689
1742-5662
DOI:10.1098/rsif.2017.0864